http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 1 1 scope this specification shall cover the characteristics of the ceramic fliter with the type ltcv10.7mj. the ltcv10.7mj filters are small, high performance and very thin (1.5 mm) chip devices consisting of 2 ceramic elements for communication equipment. they are designed on mgtio3 ceramic cap package. 2 part no. part number customer part no. specification no. ltcv10.7mj 3 outline drawing 3.1 appearance no visible damage and dirt. 3.2 dimensions drawing 1 :input :ground :output unit:mm range of frequency ? 7.0 0.3 4.1 0.4 1.2 0.3 1.2 0.3 1.5 0.2 3.0 0.3 1.2 0.3 1.2 0.3 1.2 0.3 1.5 0.2 1.2 0.3 mj
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 2 oscillation electrode cermic cover glue cermic substrate output/input electrode 3.3 structure 4 electrical specifications table 1 items requirements center frequency(fo)(mhz) the center point of 3db band width is defined as the center frequency and identified by the le tters:a,b,c,d or e. a:10.7000.030 b:10.6700.030 c:10.7300.030 d:10.6400.030 e:10.7600.030 3db bandwidth(khz) 150 40 20db bandwidth(khz) max 380 insertion loss (db) max 5.5 2.0 ripple (db) max 1.0 (within 3db bandwidth) spurious response (db) min 35 (9mhz-12mhz) input/output impedance( ? ) 330 withstanding voltage 50v dc 1 min insulation resistance (m ? ) min 100 (dc 10v) operating temperature range( ) -25 +85 storage temperature range( ) -40 +85
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 3 5 test 5.1 test conditions parts shall be tested under a condition (temperature:+20 15 humidity:65%20%r.h.)unless the sta ndard condition (temperature:+25 3 , humidity:65%5% r.h.) is regulated to test. 5.2 test circuit: drawing 2 6 physical and environmental characteristics table 2 no item condition of test performance requirements 2.1 humidity stored at 40 2 in 90% 95%r.h. for 96h, and left at room temp. for 1h before measurement. it shall fulfill the specifications in table 3. 2.2 high temperature exposure stored in 85 2 for 96h and left at room temp. for 1h before measurement. it shall fulfill the specifications in table 3. 2.3 low temperature exposure stored in -40 3 for 96h and left at room temp. for 1h before measurement. it shall fulfill the specifications in table 3. 2.4 temperature cycling after temp. cycling of -40 (30 min) to +85 (30 min) was performed 5 times, filter shall be measured after being placed in natural condition for 1h . 2.5 soldering test passed through the reflow oven under the following condition for 2 times, and left at room temp. for 24h before measurement. r2 s.s.g. rf voltmete r c2 rg 1 2 3 r1=280 (1 5%),r2=330 ? (15%),rg=50 ? :input c2=10 pf (including stray capacitance :ground and capacitance of rf voltmeter) :output s.s.g:output voltmeter
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 4 2.6 solderability dipped in 235 5 solder bath for 3s 0.5s with rosin flux. the terminals shall be at least 95% covered by solder temperature at the surface of the substrate time preheat 150 5 60s10s peak 235 5 10s3s 2.7 drop test free drop to the wood plate from the height of 70 cm for 3 times. it shall fulfill the specifications in table 3. 2.8 vibration apply the vibration of sweep frequency 10 to 55hz/minutes, amplitude 1.5mm, duration 2h in each direction of 3 planes. it shall fulfill the specifications in table 3. 2.9 board bending mount a glass-epoxy board (width=40mm, thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (see the following figure) support bar press head press mechanical damage such as breaks shall not occur. table 3 specification after test about characteristics no. item specification after test 3.1 insertion loss drift (db) max 2 3.2 3db bandwidth drift (khz) max 25 20db bandwidth drift (khz) max 60 note the limits in the above table are refe renced to the initi al measurements.
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 5 7 recommended land patter n and reflow soldering standard conditions 7.1 recommended land pattern 1.5 0.3 1.5 0.3 1.5 0.3 2.9 0.3 2.9 0.3 4.00.3 drawing 4 7.2 recommended reflow sold ering standard conditions drawing 5 8 package to protect the products in storage and transportation it is necessary to pack them outer and inner package .on paper pack, the following requirements are requested. 8.1 dimensions and mark at the end of package, the warning (moisture proof, upward put) should be stick to it. within 20s-40s within 80s-120s. within 10s pre-heating
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 6 dimensions and mark (see below) drawing 6 8.2 section of package package is made of corrugated paper with thickness of 0.8cm.package has 12 inner boxes, each box has 5 reels (each reel for plastic bag). 8.3 quantity of package per plastic reel 1000 pi eces of piezoelectric ceramic part per inner box 5 reels per package 12 inner boxes 60000 pieces of piezoelectric ceramic part 8.4 reel 1 package 2 certificate ofapproval 3 label 4 tying 5 adhesive tape 6 belt box 7 inner unit:mm max
http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 7 8.5 packing method sketch map loaded pocket blank pocket 10 pitches leader 200mm max blank pocket 10 pitches 8.6 test condition of peeling strength 10 max top tape p e e l i n g s t r e n g t h 2 0 - 7 0 g carrier tape 9 other 9.1 caution of use 9.1.1 do not use this product w ith bend. please don?t apply excess mechanical stress to the compone nt and terminals at soldering. 9.1.2 the component may be damage d when an excess stress will be applied. 9.1.3 conformal coating of the com ponent is acceptable, however the resin materials ,curing temperature a nd other process conditions should be evaluated to conform stable electr ical characteristics are maintained. 9.2 notice 9.2.1 this specification mentions the quality of the component as a single unit. please insure the compone nt is thoroughly evaluated in your application circuit. 9.2.2 please return one of this specification after your signature of acceptance. 9.2.3 when something gets doubtful w ith this specifications, we shall jointly work to get an agreement.
|
